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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Package Dimensions
Figure 12: 168-Ball FBGA – 12mm x 12mm (Package Code KL)
Seating
plane
0.08 A
168X ?0.34
Dimensions
apply to solder
balls post-reflow
A
on ?0.28 SMD
ball pads.
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Pin A1 index
Pin A1 index
A
B
C
D
E
F
G
H
12 ±0.1
11 CTR
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
0.5 TYP
Notes:
0.5 TYP
11 CTR
12 ±0.1
1. All dimensions are in millimeters.
0.7±0.1
0.23 MIN
2. Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5% Cu).
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
25
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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MT42L256M32D4KP-MS 制造商:Micron Technology Inc 功能描述:256MX32 LPDDR2 PLASTIC IND TEMP GREEN WFBGA 1.2V - Bulk